With the rapid development of the semiconductor industry, the role of test equipment in guaranteeing the performance and quality of chips is becoming more and more prominent. In this process, the TSK UF200 Probe Stage (Wafer Prober) has been widely used as a high-precision test equipment. the TSK UF200 is an important part of the probe card test system, and is capable of providing accurate and fast test solutions to meet the high standards required for modern semiconductor production. This article provides a comprehensive overview of the TSK UF200's technical specifications, areas of application, and its advantages in the industry, as well as a more in-depth look at the importance of this equipment in semiconductor testing.
TSK UF200 Technical Specifications
1. Detailed technical parameters
The TSK UF200 has been designed with a high degree of emphasis on test accuracy and reliability, with the following technical parameters:
- Detection area：Supports wafers up to 200mm in diameter, adapting to the needs of chip testing of different sizes.
- Measurement accuracy：The TSK UF200 provides sub-micron probing accuracy for wafer testing in high-density packages and advanced process nodes.
- Temperature range：The unit supports a wide operating temperature range (-40°C to 150°C), ensuring stable testing even under extreme temperature conditions.
- Electrical Performance：The UF200 provides high-precision current and voltage test functions, capable of maintaining stable test results under low-current conditions to meet the needs of different application scenarios.
- Machine structure: The equipment adopts modularized design, allowing users to flexibly adjust or upgrade the test modules according to their needs, enhancing the scalability and compatibility of the equipment.
- Automation Support: The UF200 is fully automated and supports functions such as Auto Alignment and Auto Load, which reduces manual intervention and improves test efficiency.
TSK UF200 Specification Sheet
| Accuracy | 4 micron |
| Wafer size | 5, 6 and 8 inches |
| Maximum X/Y speed | 200 mm (8 inches)/second |
| UF200 Processor | |
| Z platform/chuck | |
| Realm | 1.36 in. |
| Speed | 35 milliseconds/0.020 inches of travel |
| Revolve | ± 5° |
| Loader (Wafer Processor) | |
| Cassette capacity | 1 standard cassette; second cassette optional |
| Wafer handling | Robot arm |
| Be finely calibrated | CCD image processing |
| Hard disk drive | 100 MB |
| Floppy disk drive | 3.5 inches; 1 standard |
| Showcase | 10.4-inch color LCD |
| Power wastage | Approx. 1.5 kVA |
| Magneto-optical drive | 640MB |
| Facility requirements | |
| Atmosphere | 60 PSI @ 3 cfm。 |
| Vacuums | 25 in/Hg. |
| Perspective | 44 inches wide x 44 inches deep x 35.2 inches high |
| Weights | 2150 pounds. |
2. Design and engineering features
The design of the TSK UF200 reflects a high degree of technical innovation and engineering optimization. Firstly, its modular design not only enhances equipment flexibility, but also reduces maintenance costs. Secondly, the device utilizes advanced low thermal expansion materials that maintain stable mechanical properties at extreme temperatures. In addition, the probe tip section of the TSK UF200 has excellent abrasion resistance to maintain accuracy over long periods of repetitive testing.
The electrical interface and signal transmission system of the device have been specially designed to effectively reduce noise interference during the test process and ensure high accuracy and consistency of the measurement results. The UF200 also provides excellent support for ultra-high-frequency and high-speed signal testing, and is capable of meeting the needs of more complex chip testing in the future.
Areas of application
1.Semiconductor manufacturing
In the semiconductor manufacturing process, wafer-level testing is an important step in ensuring the quality and performance of chips, and the TSK UF200, with its high accuracy probe system, is widely used for all types of wafer testing, including but not limited to analog, digital and mixed-signal chips. Especially with the support of modern high-density packaging technologies (e.g. BGA, CSP), the UF200's micron-level probe accuracy enables it to quickly detect defects in chip manufacturing, thus greatly improving product yields.
In addition, as chip designs become increasingly complex due to emerging technologies such as 5G, AI, and IoT, the TSK UF200 is also capable of testing these complex chips to ensure that they meet the expected electrical performance before they leave the factory.
2.Research and Development
In the field of research and development, the UF200 is a powerful tool for scientists and engineers. Whether it's testing new materials or validating advanced packaging technologies, the device provides reliable test data. The UF200 performs particularly well in situations where extremely high precision and low noise are required.
For example, in the testing of new semiconductor materials (e.g., GaN, SiC), the UF200 provides stable test results at high temperatures and high voltages, helping researchers accelerate the process of materials research and technology validation.
3.Quality control
The TSK UF200 is also at the heart of quality control in semiconductor production. Through its highly efficient automated test capabilities, the device enables real-time monitoring of wafers on the production line to ensure that every wafer meets design specifications. Thanks to the device's high-precision probes and stable test platform, the UF200 is able to quickly catch potential defects, thereby reducing subsequent yield loss and rework costs.
Advantages of the TSK UF200
1. Technological innovation
The TSK UF200 offers significant technical advantages over other probe stations on the market. Its patented probe head design improves measurement sensitivity while reducing noise generated during the probing process.The UF200's control system employs advanced algorithms that intelligently optimize the testing process, reducing human intervention and improving test efficiency and reliability.
2. Performance indicators
In practice, the TSK UF200 delivers outstanding performance. Not only is the device able to test complex chips quickly, it is also able to maintain consistency of results over multiple tests. This feature is especially important for mass production wafer testing, which can significantly shorten production cycles and increase throughput.
3. User experience
In addition to its technical advantages, the TSK UF200 is also highly user-friendly. Equipped with an intuitive user interface, users can easily set test parameters and monitor the test process in real time through the graphical interface. In addition, TSK provides excellent technical support and after-sales service, allowing users to receive professional technical assistance and guidance during the use of the device.
4. Economic benefit
From an economic perspective, the TSK UF200 offers a very high return on investment (ROI). Its efficient automation capability significantly reduces labor costs and lowers operating costs through higher yields and shorter test times. For high-volume semiconductor manufacturers, the UF200 not only saves costs, but also improves market competitiveness.
Industry Trends and Future Outlook
1.Market Demand Analysis
As the global semiconductor market continues to expand, especially driven by emerging technology areas such as 5G, Artificial Intelligence, and the Internet of Things (IoT), the demand for high-performance probe table equipment continues to grow. the UF200's flexibility, accuracy, and high efficiency make it a mainstream piece of equipment widely used in the semiconductor industry, and it is well-positioned to meet the market's rapid growth in the coming years.
2.Direction of technological development
The future of probe test equipment will move towards intelligence and automation. With the further integration of AI technology, test equipment will be able to optimize the test process through autonomous learning, improving efficiency and reducing error rates. the modular design and open architecture of the TSK UF200 enables it to adapt to future technological upgrades and expansions, laying a solid foundation for future technological development.
3.Competitive environment
Although there are several brands of probe table equipment on the market, the TSK UF200 maintains a competitive edge in the global market due to its excellent performance, strong technical support and wide range of applications. Its cost-effective and stable market performance sets it apart from other brands.
The TSK UF200 is widely recognized as the flagship equipment in the semiconductor test field for its high precision, high efficiency and high reliability. Whether it is for wafer testing on production lines or for verifying new technologies in the field of scientific research, the UF200 has demonstrated its outstanding performance and technical advantages. With the continuous development of the semiconductor industry, UF200 will have a broader application prospect in the future, and will play a more important role in improving the quality and efficiency of semiconductor manufacturing.
