The TEL P12 XLn wafer prober, developed by Tokyo Electron Ltd. (TEL), represents a cutting-edge solution in semiconductor testing. TEL, a global leader in semiconductor manufacturing equipment, has consistently driven innovation to meet the growing demands of the industry. Wafer probers like the P12 XLn play an indispensable role in both research and development (R&D) and production environments, ensuring that semiconductor devices meet rigorous performance and quality standards.
As one of the authorized distributors of TEL P12 XLn wafer probers, JUNR is committed to providing our customers with the best tools for semiconductor testing. You can learn more about our offerings and reach out for detailed consultations through our Email: shansy@junr.com.cn.
The TEL P12 XLn’s technical capabilities are designed to meet diverse testing requirements. Below are the key specifications:
Parameter | Specification |
---|---|
Wafer Size | 150mm, 200mm, 300mm |
Probing Accuracy | <1μm |
Temperature Range | -40°C to +150°C |
Automation | Full wafer handling automation |
Supported Probes | RF, MEMS, high voltage, optical |
Data Integration | Seamless integration with fab management systems |
The TEL P12 XLn combines precision, reliability, and adaptability, making it a leading choice for advanced wafer testing. Below are the core features that set it apart:
The TEL P12 XLn is versatile, catering to various aspects of semiconductor manufacturing and research:
R&D Testing
Production Line Testing
Specialized Applications
The TEL P12 XLn wafer prober stands out in the competitive landscape of semiconductor testing equipment. Below is a detailed analysis comparing the P12 XLn with similar models from leading manufacturers, focusing on critical aspects such as precision, reliability, automation, and versatility.
Manufacturer | Model | Key Features | TEL P12 XLn Advantage |
---|---|---|---|
KLA Tencor | P6 Prober | Entry-level automated prober; limited wafer size support (up to 200mm); semi-automation for specific tasks. | P12 XLn offers full 300mm wafer support, superior automation, and advanced temperature control. |
PA200 | High-precision manual prober; excellent for R&D but lacks scalability for high-volume production. | P12 XLn provides full automation and better throughput for production environments. | |
FormFactor | Summit 12000 | Advanced R&D-focused prober; supports various modules like cryogenic testing and RF measurements. | P12 XLn matches versatility but outperforms in automated wafer handling and thermal stability. |
CM300xi | Production-oriented; supports 300mm wafers and high-frequency probing. | P12 XLn delivers better environmental controls and modular customization. | |
Accretech | UF3000EX | Multi-purpose 300mm wafer prober with solid accuracy and stability. | P12 XLn offers more robust integration capabilities and advanced vibration isolation. |
UF3000Pro | High-end model with ultra-precise probing for 5nm and below nodes; costly for general production use. | P12 XLn balances cost-effectiveness with top-tier performance for both R&D and production. |
The TEL P12 XLn wafer prober is an advanced, versatile solution for semiconductor testing, excelling in precision, reliability, and adaptability. It is an ideal choice for R&D labs, production lines, and specialized applications, offering unparalleled accuracy and efficiency.
As one of the trusted distributors of the TEL P12 XLn, JUNR is proud to bring this state-of-the-art technology to our customers. Whether you are looking for detailed specifications, pricing, or expert advice on how the TEL P12 XLn can fit into your operations, we are here to help.
Visit our website at www.junr.com.cn or contact us today to learn more about this exceptional product and how it can transform your semiconductor testing capabilities.