Gasonics Aura 1000 vs Aura 2000 : Plasma Ashers for Semiconductor Manufacturing

1. Introduction

In the world of semiconductor manufacturing, precision and efficiency are key. Plasma ashing, a process used to remove photoresist after the lithography stage, plays a crucial role in ensuring the quality and integrity of the final product. Two prominent tools in this field are the Gasonics Aura 1000 and Gasonics Aura 2000 Plasma Ashers. Both of these systems are designed to meet the demanding requirements of wafer processing, offering unique features that cater to different production needs.

While the Aura 1000 has been a mainstay in the industry for years, the Aura 2000 offers significant advancements, making it an ideal choice for the latest semiconductor process nodes. This article will provide a detailed comparison of both models, outlining their features, benefits, and applications, to help semiconductor manufacturers select the right tool for their needs.

2. What is Plasma Ashing?

Plasma ashing is a process used primarily in semiconductor fabrication to remove organic materials, such as photoresist, from a wafer’s surface. This process involves exposing the wafer to plasma, a highly reactive mixture of gases that breaks down photoresist into smaller, less harmful molecules that can be safely removed.

Unlike traditional wet etching or dry etching, plasma ashing is a downstream process, meaning the plasma interacts with the wafer without directly irradiating it. This results in less damage to the wafer’s surface and is crucial for high-precision semiconductor fabrication, particularly when working with small geometries or thin films.

Key Benefits of Plasma Ashing:

• High precision: The process can target specific areas without affecting the underlying materials.
• Non-invasive: Since the wafer is not subjected to mechanical stress or radiation, the risk of damage is minimized.
• High throughput: Plasma ashing can be performed quickly and effectively, enhancing overall production efficiency.
• Flexible process conditions: The ability to adjust gas flow and power allows for optimization of the ashing process for different materials and wafer sizes.

3. Gasonics Aura 1000 Plasma Asher: Features and Specifications

The Gasonics Aura 1000 is a well-established system in the field of semiconductor manufacturing, providing a reliable and efficient solution for photoresist removal. This system is built around a single-wafer processing platform, offering automated cassette-to-cassette handling, which streamlines the process and ensures high throughput.

Key Features of Gasonics Aura 1000:

• Single-wafer processing: The system processes one wafer at a time, making it suitable for applications that require high precision and low damage rates.
• Microwave plasma generator: This generates reactive oxygen plasma that effectively removes both front and backside photoresist.
• Downstream ashing process: The reactive gases flow downstream into the process chamber, creating a chemically neutral environment to prevent damage to the wafer.
• Wafer size compatibility: The system can handle 3-inch, 4-inch, 5-inch, and 6-inch wafers.
• Infrared heat source: This is included to enhance the processing temperature control, particularly for temperature-sensitive processes.
• High throughput: The Aura 1000 can process up to 60 wafers per hour, depending on the process parameters.
• Automatic wafer handling: The automatic loader/unloader streamlines the wafer handling process and reduces human error.
• Compact design: With a footprint of 36” x 32” x 27”, the system is space-efficient, especially in high-volume production environments.

Detailed Specifications:

The Gasonics Aura 1000 is particularly beneficial for standard semiconductor manufacturing needs, providing a balanced solution with a focus on reliability and ease of use. Its ability to perform both front and backside resist removal and its automated handling system make it ideal for high-throughput applications where precision is paramount.

4. Gasonics Aura 2000 Plasma Asher: Features and Upgrades

The Gasonics Aura 2000 represents a significant upgrade over the Aura 1000, catering to the evolving demands of the semiconductor industry. With increased wafer size support, improved gas flow control, and enhanced endpoint detection, the Aura 2000 is designed to meet the needs of smaller process nodes, such as 7nm and 5nm.

Key Upgrades in the Gasonics Aura 2000:

• Higher throughput: The Aura 2000 offers faster processing speeds, with throughput capabilities surpassing the Aura 1000.
• Multi-gas flow control: The system can handle up to 4 MFCs (Mass Flow Controllers), allowing for greater flexibility in process gas selection and precision.
• Larger wafer support: In addition to the common 3-inch, 4-inch, 5-inch wafer sizes, the Aura 2000 is capable of processing larger wafers (e.g., 8-inch) to accommodate the latest manufacturing requirements.
• Enhanced endpoint detection: The advanced endpoint detection technology ensures precise photoresist removal, minimizing the risk of over-etching or under-etching.
• Optimized temperature control: With improved closed-loop temperature control and advanced infrared heating technology, the Aura 2000 offers better temperature stability, which is essential for high-precision processes.
• Improved plasma uniformity: The Aura 2000 features upgraded plasma generation that ensures even and consistent photoresist removal across the entire wafer surface.

Detailed Specifications:

The Aura 2000 is the ideal solution for semiconductor fabs working with advanced process nodes. Its higher throughput, expanded wafer compatibility, and enhanced gas control system make it suitable for a wide range of high-precision applications. Additionally, the advanced endpoint detection ensures that the photoresist removal process is both efficient and controlled, making it the preferred choice for the most demanding wafer fabrication environments.

5. Aura 1000 vs. Aura 2000: A Detailed Comparison

While both the Aura 1000 and Aura 2000 are highly capable systems, the Aura 2000 offers several upgrades designed to cater to advanced semiconductor manufacturing. Below is a comprehensive comparison of their performance, features, and capabilities.

Performance and Efficiency:

• Aura 1000: Offers reliable performance for moderate-volume production environments. While it may not offer the same level of throughput as the Aura 2000, it is still a very efficient system that can handle various wafer sizes and processing needs. It is ideal for applications requiring low damage and precise photoresist removal without the need for high-end customization.

• Aura 2000: The upgraded version features faster processing speeds with the ability to handle more wafers per hour (up to 90 wafers/hour), making it suitable for high-volume production of advanced semiconductor devices. The increased wafer size compatibility (including 8-inch wafers) and superior plasma uniformity make the Aura 2000 a better choice for manufacturers working on cutting-edge nodes, such as 7nm and 5nm.

Endpoint Detection:

• Aura 1000: Uses a basic photo emission-type end-point detection system, which is effective for standard wafer ashing applications. It ensures that the process stops once the resist has been fully removed.

• Aura 2000: Features advanced photoresist detection that provides more precise monitoring of the ashing process, helping to minimize over-etching and under-etching. This is particularly important for advanced node devices where even minute variations in process parameters can lead to significant performance issues.

6. Key Benefits of Gasonics Aura Series for Semiconductor Manufacturers

The Gasonics Aura Series—including both the Aura 1000 and Aura 2000—offers numerous benefits that cater to the needs of modern semiconductor manufacturers.

Key Benefits:

1. 1. Low Cost of Ownership:

   • The Aura 1000 is known for its low cost of ownership, offering a competitive solution for those who need reliability at a relatively low initial investment. With an uptime of over 95%, the Aura 1000 ensures consistent performance over time, making it a valuable addition to production lines.
   • While the Aura 2000 comes at a higher cost due to its advanced features, it offers superior processing speed and enhanced precision, making it ideal for manufacturers working with smaller nodes that require higher throughput and tighter process control.

2. 2. High Reliability and Uptime:

   • Both models have been designed with robust reliability, ensuring that manufacturers experience minimal downtime. The Aura series has been thoroughly tested to meet industry standards, providing confidence in its performance.
   • The Aura 1000 boasts an MTBF (Mean Time Between Failures) of over 100 hours, while the Aura 2000 has similarly high reliability metrics, making them ideal for both high-volume and precision-based semiconductor production.

3. 3. Efficient Processing for Advanced Nodes:

   • The Aura 2000 is especially suited for advanced semiconductor process nodes like 7nm and 5nm, offering higher throughput and better plasma uniformity, which are crucial for the manufacture of next-generation chips. With precise endpoint detection, it ensures that photoresist stripping is done with minimal risk of damage to delicate underlying films.

4. 4. Flexible Wafer Handling:

   • Both systems offer automatic wafer loading and unloading, which enhances throughput while reducing human error. However, the Aura 2000 can accommodate larger wafer sizes (up to 8 inches), making it more versatile for high-end production needs.

5. 5.Precise Temperature Control:

   • Closed-loop temperature control, supported by infrared heat sources, is another benefit of both models. This feature is critical in controlling the thermal environment during the ashing process, especially for temperature-sensitive materials.

6. 6. Scalability and Versatility:

   • The Aura 1000 is ideal for smaller operations or those working with standard wafer sizes, while the Aura 2000 offers better scalability for higher-end processes that require flexibility in wafer size, gas flow, and temperature control.

7. Conclusion

Both the Gasonics Aura 1000 and Aura 2000 Plasma Ashers offer unique advantages that cater to different needs within the semiconductor manufacturing industry. The Aura 1000 is an excellent choice for standard wafer stripping, offering a reliable, cost-effective solution with high throughput and easy operation. On the other hand, the Aura 2000 excels in high-volume production environments where advanced process nodes, larger wafer support, and precise process control are crucial.

Manufacturers working with cutting-edge technology, such as 7nm and 5nm nodes, will benefit from the Aura 2000's superior precision and scalability, while those in more traditional semiconductor production can continue to rely on the well-established Aura 1000. Both systems are designed to enhance process efficiency and yield, ensuring that manufacturers stay competitive in an ever-evolving industry.

8. FAQs

Q1: What is the cost of ownership for the Gasonics Aura 1000?
The Aura 1000 is designed to have a low cost of ownership, with a high uptime of over 95%, reducing maintenance costs and downtime.

Q2: How does the Aura 2000 perform with 5nm process nodes?
The Aura 2000 excels with 5nm nodes due to its advanced endpoint detection system, improved plasma uniformity, and increased throughput, making it suitable for precision ashing processes.

Q3: Can the Aura 1000 be upgraded to Aura 2000 features?
While both systems share some common features, the Aura 2000 includes enhanced plasma control, larger wafer support, and advanced gas flow control, which cannot be easily retrofitted into the Aura 1000.

Q4: What is the maximum throughput of both models?

• Aura 1000: Up to 60 wafers per hour (depending on process parameters).
• Aura 2000: Up to 90 wafers per hour, offering higher processing speeds for larger volume needs.