1. Introduction to Probe Card Repair

In the semiconductor industry, the probe card plays a pivotal role during wafer-level testing, serving as the interface between the tester and the integrated circuits (ICs) on the wafer. As the first point of physical contact, the probe card must maintain high precision and mechanical integrity to ensure accurate signal transmission and yield assurance.
Over time, due to repetitive mechanical contact and thermal cycling, probe cards experience wear and degradation. This can result in poor contact, signal loss, or even wafer damage. A carefully executed probe card repair process restores the card’s functionality, extending its lifecycle and preserving test performance without the need for full replacement.
2. Common Issues That Require Probe Card Repair
Probe card damage is inevitable in high-volume semiconductor testing environments. Prompt and precise repair is crucial to avoid yield loss or inaccurate test data. Below are some of the most frequent issues encountered:
Typical Problems:
Issue Type | Description |
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Worn Probe Tips | Probes become blunted or lose tip length due to repeated wafer contact. |
Burnt Needles | Electrical overstress during testing can burn the probe tip. |
Needle Height Variations | Uneven or unstable probe tip heights affect electrical contact reliability. |
Probe Tip Misalignment | Misalignment causes probe marks to deviate from target pad positions. |
Multi-site Calibration Drift | Step sizes may shift, especially in high-density multi-site probe cards. |
In cases where one or more needles are below repair threshold or show signs of burning, it is sometimes necessary to reset the probe array—a process that requires disassembling and reattaching probes with precise spacing.
3. Our Probe Card Repair Process
At JUNR Semiconductor, we follow a systematic and data-driven approach to probe card repair. Our repair services aim not only to restore functionality but also to ensure consistent electrical performance post-repair. The process is as follows:
Step-by-Step Repair Workflow:
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3.1 Visual & Functional Inspection
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Initial check of probe card condition using microscopes and test equipment.
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Identification of damaged, bent, or missing probes.
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3.2 Evaluation of Repair Feasibility
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Measurement of current needle heights and comparison to original specs.
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Analysis of burn marks or severe probe deformation.
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Determination of whether re-tipping, realignment, or full reconfiguration is necessary.
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3.3 Customer Consultation (if applicable)
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If any needles fall below the minimum repair length or have sustained burn damage, we contact the client to discuss rework options.
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For board reset cases, written customer confirmation is required before proceeding.
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3.4 Precision Repair Execution
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Mechanical adjustment of tip height and planarity.
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Re-polishing or replacement of probe tips as needed.
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Special handling for multi-site step calibration.
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3.5 Cleaning & Surface Preparation
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Removal of contaminants from the probe surface to ensure optimal electrical contact.
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3.6 Final Testing & Quality Check
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Electrical continuity and resistance tests to confirm functionality.
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Optical inspection to verify geometric alignment.
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4. Information Required from Clients for Repair
To perform accurate and effective probe card repair, it is essential for clients to provide detailed technical data about the card. This ensures the repaired probe card aligns perfectly with the original wafer layout and test parameters.
Required Client Data:
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Pad Coordinates:
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A detailed pad layout file (usually in .txt or CAD format) containing the X-Y coordinates of the probing points.
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Original Probe Tip Dimensions:
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Probe mark size and initial needle length to evaluate wear levels and maintain uniformity during repair.
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Multi-site Configuration:
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For multi-DUT (device-under-test) probe cards, clients must provide step sizes that include the distance across each site and scribe lane dimensions.
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Damage Declaration:
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If probe burning or breakage has been observed, the extent should be reported for evaluation.
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If the tips are shorter than the repairable standard, a reset option will be suggested.
5. Repair Report and Quality Control
At JUNR, we believe that a transparent and data-driven approach to probe card repair is critical to earning our clients’ trust. That’s why every repaired probe card is accompanied by a comprehensive repair report that outlines the work performed and the quantitative results before and after servicing.
What’s Included in Our Repair Report:
Report Section | Details |
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Pre-Repair Probe Tip Measurements | Needle lengths, deviations, and condition of each probe |
Post-Repair Probe Tip Data | Adjusted needle lengths and planarity results |
Burnt or Non-Repairable Probes | Quantity and location of damaged probes |
Repair Methodology | Description of procedures used (e.g., re-tipping, realignment, reset) |
Final Electrical Test Results | Contact resistance and continuity test results |
Visual Inspection Summary | High-resolution images showing condition before and after repair |
Every report is reviewed internally by a senior technician before release. If any inconsistencies remain post-repair, the card will be reworked immediately at no additional cost.
Strict Quality Assurance Protocols:
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Calibrated inspection and measurement tools
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Dual-check validation (optical + electrical)
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ISO-compliant process control documentation
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100% functional testing before return shipment
We understand that probe card reliability directly impacts wafer yield. That’s why quality is never compromised in our facility.
6. Why Choose JUNR for Probe Card Repair
Choosing the right partner for probe card maintenance is not only about technical ability—it’s also about trust, turnaround, and cost-efficiency. Here’s why global semiconductor clients rely on JUNR:

✅ Technical Expertise
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Decades of experience in probe card assembly and diagnostics
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Familiarity with major probe card types (cantilever, vertical, MEMS-based)
✅ Comprehensive Capabilities
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Repair, re-tip, realignment, cleaning, reconfiguration
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Support for multi-site and high-density applications
✅ Quick Turnaround
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Standard repair cycles completed within 3–5 business days
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Priority rush service available upon request
✅ Cost Efficiency
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Significantly lower cost than purchasing new probe cards
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Extended lifespan of existing test assets
✅ Clear Communication
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Transparent repair proposals and real-time status updates
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Customer approval required for any major structural changes
7. Contact Us for Expert Probe Card Repair Services
If you are experiencing decreased yield, failed probe points, or suspect that your probe card may require inspection, don’t wait until it becomes a bottleneck. At JUNR, we offer fast, reliable, and technically sound repair services for a wide range of probe card types.
Whether it’s a routine adjustment or a complex multi-site reconfiguration, our skilled technicians are ready to support your needs.
Consultation for Equipment, Accessories, and Services
Contact Person: Shan Shuyong
Mobile: 13506193015
Email: shansy@junr.com.cn
Website: https://junr.com.cn