TSK UF3000 vs UF2000 vs AP3000 - For 200mm and 300mm Semiconductor Testing

1. Introduction: The Evolution of Wafer Probing Technology

Over the past two decades, wafer probing systems have undergone significant evolution — adapting to larger wafer diameters, higher integration densities, and stricter accuracy requirements. As semiconductor devices transitioned from 200 mm to 300 mm wafers, precision in alignment, thermal control, and data acquisition became critical for yield optimization.

ACCRETECH / TSK, a leading Japanese manufacturer, has been at the forefront of this evolution. Their UF series and AP series wafer probers represent distinct generations of technological advancement. Each model — UF2000, UF3000, and AP3000 — serves a specific stage of semiconductor testing, from legacy production lines to state-of-the-art 300 mm fabs.

The purpose of this comparison is to help semiconductor professionals, test engineers, and secondary-market buyers understand the technical differences, application scopes, and long-term value between these three industry-leading wafer probers.

2. Overview of the Three Models

To understand the differences, let’s first define the positioning and purpose of each model:

UF2000 — Reliable 200 mm Prober for Mature Processes

The TSK UF2000 is one of ACCRETECH’s most widely adopted 200 mm wafer probers. Known for its mechanical robustness, low maintenance, and stable performance, it remains popular among fabs testing analog, MEMS, or power semiconductor devices.
Its simplicity and cost-effectiveness make it ideal for environments where automation is less critical but repeatability and uptime are essential.

UF3000 — Bridge Between Legacy and Modern 300 mm Probing

The UF3000 was developed as a transition model when the industry shifted from 200 mm to 300 mm wafers. It offers enhanced accuracy, smoother motion control, and compatibility with various testers.
For many second-hand buyers, the UF3000 represents a sweet spot — supporting 300 mm wafers without the high cost of the latest-generation systems.

AP3000 — Flagship Prober for Advanced 300 mm Applications

At the high end of the lineup, the AP3000 provides fully automated wafer handling, superior temperature stability, and sub-micron alignment accuracy.
It’s designed for leading-edge fabs dealing with logic and memory devices at advanced process nodes.
The AP3000 is also compatible with automated material handling systems (AMHS), enabling true 24/7 production operation.

3. Key Technical Specifications Comparison

To clearly illustrate the technical distinctions between the three systems, the following table summarizes major performance metrics and features:

4. Performance and Throughput Comparison

Performance and throughput are crucial indicators when choosing between different wafer prober models, especially in production environments with varying test demands.

• The UF2000 serves lower-volume or engineering environments, prioritizing reliability over raw speed.

• The UF3000 strikes a practical balance — improved wafer handling and motion optimization result in ~50% higher throughput than the UF2000.

• The AP3000 offers the highest productivity, optimized for mass production and 24/7 fab operation, where every second of cycle time reduction translates to substantial yield and cost benefits.

5. Automation, Control, and Interface Advancements

Automation represents one of the key differentiators between the three systems.
Each successive generation of ACCRETECH wafer probers introduced significant innovations in handling precision, process integration, and user interface design.

UF2000 — Manual and Semi-Automatic Flexibility

• Designed for engineers who need direct mechanical access for setup and troubleshooting.

• Simple operator interface with manual chuck control and limited recipe storage.

• Ideal for low-volume or R&D test environments.

UF3000 — Step Toward Automated Probing

• Incorporates robotic wafer handling and automated alignment features.

• Enhanced GUI for recipe programming and auto-calibration.

• Supports both semiautomatic and full-auto modes depending on fab requirements.

• Improved safety interlocks and wafer mapping functions reduce human error.

AP3000 — Fully Automated Production-Grade Platform

• Features dual-arm wafer handling robots for seamless continuous operation.

• Integrated AMHS compatibility, allowing connection to automated factory transport systems.

• Advanced diagnostic software, auto height calibration, and real-time wafer tracking improve yield consistency.

• Fully compliant with SEMI communication standards (E84, GEM/SECS).

6. Accuracy and Stability in Probe Performance

Precision and stability are the defining characteristics of any wafer prober — particularly for 300 mm devices where sub-micron alignment is necessary.

Thermal and Mechanical Stability

• UF2000: Passive temperature regulation; mechanical rigidity ensures long-term reliability.

• UF3000: Improved chuck temperature control (20–150°C).

• AP3000: Active thermal compensation for uniform temperature distribution across 300 mm wafers, minimizing test variation.

7. Maintenance, Serviceability, and Spare Parts Availability

When purchasing or operating wafer probers—especially refurbished units—maintenance and parts support become critical factors.
The total cost of ownership can vary significantly among the three models due to design complexity and component lifespan.

UF2000 — Simple and Cost-Efficient Maintenance

• Designed with mechanical simplicity and low part count, making it easy to maintain in-house.

• Most repairs can be performed without specialized diagnostic tools.

• Spare parts are readily available in the secondary market.

• Minimal downtime, ideal for fabs that prioritize operational continuity over automation.

UF3000 — Balanced Maintenance Profile

• Incorporates more automation and sensors, but remains technician-friendly for service.

• Preventive maintenance routines (PM) are straightforward, with diagnostic software aiding calibration.

• Replacement components such as chuck tables, robot arms, and sensors are widely supported.

• Typically, mid-range maintenance cost with solid service network coverage worldwide.

AP3000 — Complex but Predictive Maintenance Ready

• High level of automation increases maintenance complexity.

• Requires periodic software calibration, robot re-alignment, and thermal tuning.

• However, its built-in diagnostic systems allow predictive maintenance, minimizing unexpected downtime.

• Best suited for fabs with strong engineering support and established service contracts

8. Which Model Should You Choose?

Selecting the right wafer prober depends on production goals, budget, and technical requirements.

Recommendation Matrix

Summary

• Choose UF2000 if your operation focuses on cost efficiency and 200mm device testing.

• Choose UF3000 for balanced performance, automation, and affordable scalability.

• Choose AP3000 for high-end production environments requiring continuous, automated wafer probing.

9. Conclusion: The Value of Selecting the Right ACCRETECH Prober Partner

The UF3000, UF2000, and AP3000 together represent a complete roadmap of ACCRETECH / TSK’s innovation in wafer probing—from legacy 200 mm systems to fully automated 300 mm solutions.

Choosing between them requires more than just technical comparison—it involves evaluating your fab’s current capability, upgrade path, and service ecosystem.

At JunR Technology , we specialize in refurbished and fully qualified ACCRETECH wafer probers, offering:

• Complete testing and calibration before delivery.

• On-site installation and operator training.

• Reliable spare part supply and after-sales service.

Whether you’re maintaining a legacy production line or upgrading to 300 mm testing, our expertise ensures that your investment in UF2000, UF3000, or AP3000 systems delivers maximum performance and reliability.