JUNR supply one-stop wafer sort CP TEST solution
This test is the report card on the fabrication process. During the test, each chip is electrically tested for electrical performance and circuit functioning. Wafer sort isalso known as die sort or electrical sort.
For the test, the wafer is mounted on a vacuum chuck and aligned to thin electrical probes that contact each of the bonding pads on the chip . The probes are connected to power supplies that test the circuit and record the results. The number,sequence, and type of tests are directed by a computer program. Wafer probers are automated so that, after the probes are aligned to the first chip (manually or with an automatic vision system), subsequent testing proceeds without operator assistance.
The goal of the test is threefold.
- First is the identification of working chips before they go into the packaging operation.
- Second is characterization of the device or circuit electrical parameters. Engineers need to track the parameter distributions to maintain process quality levels.
- The third goal is an accounting of the working and nonworking chips to give fab personnel feedback on overall performance (yield).
The location of the working and nonworking chips is logged into a wafer map in the computer. Older technologies deposit a drop of ink on the nonworking chips. Wafer sort is one of the principal yield calculations in the chip-production process. It also gets more expensive as the chips get larger and denser. These chips require more time to probe, power supplies, wafer handling mechanics, and computer systems have to be more sophisticated to perform the tests and track results. The vision systems must also evolve in sophistication (and cost) with expanding die size. Cutting the chip test time is also a challenge. Chip designers are being asked to include test modes for memory arrays. Test designers are exploring ways to streamline test sequences using stripped-down tests once the chip is fully characterized, performing scan tests of the circuit, and parallel testing different circuit parts.
what is our one-stop soulution for wafer sort ?
1. JUNR sales TSK 、EG brand wafer prober and related parts ；
2. JUNR can design and manufacture probe card ;
3. JUNR supply probe pin ；
4. JUNR offer a full range of test spare parts and consumables.
It contains board、motor 、ink and inking ect；
5. Junr specializes in providing refurbished customized golden chuck ；
6. JUNR main business is Tsk and EG prober maintenance、renovation、installation and debugging；
what is our business in CP test filed ?
○ Whole TSK UF3000/UF200/A/SA/APM90A probe and services
○ TSK UF3000/UF200/A/SA/APM90A probe accessories and consumables
○ Whole EG2001probe and all kinds of related parts
○ Baking ink 6993（DM-1）
○ Non-drying ink 8103（DM-1）
○ Inker and three-dimensional adjustment bracket
○ probe card and prob pin
○ customized/repair/refurbishment
○ ESI9350 equipment / laser tube/ Interferometer
- JUNR supply solenoid driven inking
JUNR Inking
Systems are available in Electric models and utilize convenient, disposable JUNR
Ink Cartridges to streamline and optimize the process of marking defective die.
With models available for nearly every TSK Prober test platform and
configuration.
Electric
Inking systems deposit ink dots through actuation of a solenoid, which in turn
moves the JUNR cartridge nylon filament up and down. Filament movement draws
ink down the filament from the cartridge reservoir to the wafer surface. A
standard ink reservoir is combined with a variety of needle and filament
configurations for different applications and dot sizes.
