JUNR SUPPLY ONE-STOP P5000 PECVD Repair and parts
1. System overview
The applied materials p5000 PECVD system is a multi-chamber plasma enhanced chemical vapor deposition (PECVD) tool.
2. Substrate Requirements :
The tool is configured for 6 inch wafer processing.
Processing of 4 inch wafer and smaller pieces is enabled by use of a 150mm carrier wafer with recessed 100mm area.
This 150mm carrier wafer with recessed 100mm area must be used for 100mm wafer and samller pieces.
Do not use Crystalbond , PFPE , Santovac, or other bonding / mounting material.
Thickness : Do not process samples that are thicker than 1200um thick.
Substrate surfaces should be clean and free from particulates.
Wafer are transfer to the process chambers and are processed one at a time with deposition on only the top side of the substrate. Standard recipes operate at 200-400 degree. Substrate heating is accomplished by lamps located under the susceptor that the wafer rests on during processing. This system has a single frequency RF power source at 13.56MHZ that is delivered to the chamber through an auto-matching network.
1. Introdcution to the tool
Wafer are loaded into one of the 150mm cassettes available at the tool. The robot has been calibrated to the load cassettes. Do not use other 150mm cassettes! Use of another cassette may cause damage to the robot and to your wafer/samples! Do not process samples that are thicker than standard wafer thicknesses. If processing with a 6 inch
carrier wafer, do not exceed a total thickness for carrier sample of 1200um .
The tool transfers wafer from the load cassette to the eight slot storage elevator inside the tool load lock. After this transfer is complete , the load lock slit valve closes and the load lock pump down.Wafer are then transferred from the storage elevator to the process chamber for film deposition. After deposition, a chamber clean is performed to strip film from inside the chamber to prevent film cracking / delamination and particle gneration inside the chamber . The chamber clean time needs to be set appropriately for the film thickness that was deposited.
2. Tool requirement
2.1 Reserve the tool and activate your reservation
2.2 Fill out the log sheet for the process you will be running
2.3 To login , select ststem - login/ logout . If needed , logout current user by clicking on the user name , then select system - login/ logout again. User name and password are both user
2.4 Go to control and set / confirm system state as manual ;
2.5 Verify the chamber you need is online for process and idle under service -- vacuum service
2.6 Go to chamber X - Monitor chamber to confirm chamber is at the temperature you need.
2.7 To load wafers , select wafer - monitor wafer and click on open door . If the cassette is clamped, select " Release A " Left or " Release B " Right for the cassette you will use.
2.8 Remove cassette. Load wafers process side "UP" ( away from H-bar ) . Align major flats square with cassette opening.
For 100mm wafers or pieces, places on recessed carrier wafer and space every other slot.
2.9 Place cassette in load station . Align H-bar to depress the micro switch.
2.10 To set up your process recipe , go to program -- process programs and select the recipe you will run . Update time in the DEP STEP FOR desired thickness based on dep rate of the film . Also ,update time in stabilize temp ( min 30 sec , max 270 sec 0
2.11 To set up the clean recipe, go to program - process programs and select clean recipe for your process. Update time in clean step based on etch rate of the film and your film thickness and remember to add 13 seconds to remove seasoning coat . Do not exceed max time for your clean recipe. you may need to run multiple cleans manually allowing to cool in between.
2.12 Go to control screen and select the clean recipe under cleaning process for your chamber if you want the clean to execute automaticaly after each wafer deposition. if you will be manually running the clean after your deposition, enter blank selection instead.
2.13 Go to system -- enter wafer lot name . On the line after " for whole cassette" for your cassette (A or B) , select Lot Name associated with recipe / film to deposit.
2.14 Go to wafer -- monitor wafer screen and toggle to "CLAMP A" OR " CLAMP B"
2.15 Delete wafers from the cassette display on the screen so only slots to be processed remain.
2.16 Go to control sand change system state to automatic. Wait for system to home robot.
2.17 select wafer - Run to begin processing your samples.
2.18 During processing , you can go to chamber A , B or C -- Monitor chamber or monitor process
2.19 Report any errors
2.20 To unload when all wafer processing is finished , select wafer -- unload cassette.
2.21 Unload your wafers and return the empty cassette to the load station.
