GaSonics AURA1000/AE2001/L3510 销售及相关服务
君睿科技作为专业的二手半导体设备供应商及服务商，我司重点提供AURA1000、AE2001、L3510设备并提供设备的翻新(重点是Chamber的翻新)，改造(手臂的改造)、维修及装机等技术服务，提供相关配件和耗件，我司提供的耗件及配件均有我司LOGO 及统一编号，期待与贵司的合作。
- ● AURA1000/LAE2001/L3510 整机供应
- ● AURA1000/AE2001/L3510全系列配件供应
- ● AURA1000/AE2001/L3510 设备翻新及改造及维修等相关技术服务
- ● Features:
- Cassette to cassette wafer handling
- Front and backside etching
- Variable platen temperature
- Alumina(ceramic) plasma tube
- Fluorine compatible chamber
- SECS ll interface
- Multiple step process capability
- Stand alone/ floor standing model
- ● GaSonics L3510Elsotropic Etch System
- ● Description:
- The GaSonics L3510E is a high etch rate,downstream isotropic etching system.
- designed to provide isotropic profiles along with the ability to etch or ash at low temperatures Utilizing the proven L-Series 3510 platform,the etch system also uses the downstream microwave sources and applicator.With excellent process controls.
- the 3510E provides a wide range of process capabilities and applications.
- The system also includes a topside lamp option for heating the substrates in a “pins up” mode.
- The “pins up" mode allows backside etching of various materials.
Gasonics去胶系列设备，适用于4、6、8英寸去胶制程；采用微波功率源，去胶速率快，其中A1000、A2000、L3510为单腔体设计，PEP3510为双腔体设计。设备占用空间小，适用于规模化生产；同时操作界面简单、维护方便、机台利用率高，性价比高，可根据工艺需求及预算选择适用机型。其市场占有率高，备件渠道完善。
The A-1000 uses microwave energy generated by a magnetron , and coupless this energy to the plasma chamber via a waveguide.
The combination of the waveguide and the plasma msut appear as a pure resistance of a specified value to the magnetron, or some of the energy is reflected back towards the magnetron. which obasorbs and dissipates it as heat. Tuning minimize magnetron heat load, and maximize power coupling .
The A-1000's waveguide and plasma are matched to the magnetron with a tuning rod that chanes the resistance (impedance) of the waveguide. The amount of rod tip protruding into the waveguide provides a given resistance , The impedance changes when the amount of rod present in the waveguide is increased or decreased .
if you have as belw maintenance question for Gasonics A-1000 , feel free to contact us .
1. Alignment procedure
2. Tool required
3. RF turing methods
4. Vacuum gauge calibration
5. Gas flow calibration
6. chamber cleaning , plasma tube installation and removal
7. showerhead assembly
Showhead assembly procedure as bleow :7.1 Disassembly procedure
7.1.1 remove the screen holding the showerhead to the showerhead housing ;
7.1.2 remove the inner quartz disk and set aside
7.1.3 remove the showerhead housing , set aside and clean top cover with IPA
7.1.4 CLEAN EACH Piece of the showerhead with IPA and allow to dry , re-assemble
7.1.5 Flush each screw removed from the inside of the chamber carefully with IPA
7.2 Cleaning and re-assembly
7.2.1 clean and inspect the O-rings removed earlier. If demaged , replaced them . Clean new or Old o-RINGWITH IPA . placed them carefully into their groove in the top of the chamber.
7.2.2 re-assemble the chamber in the reverse order from which it was disassembled .
7.2.3 Check out
7.2.3.1. Turn on the systme and allow it to go to idle .
7.2.3.2 Turn the keyswitch to service
7.2.3.3 Press Stop twice
7.2.3.4 Press the front panel button for soft start . Waiti until the pressure display un-blanks , and press the button for man vacuum ;
7.2.3.5 Press SOFT START again to shut it off. Observe the pressure reading :It should be below 0.10 Torr.
7.2.3.6 After 5 minutes , press MAIN VACUUM button again .This seals off the chamber , and allows checking of the leak-back rate.
The rate should be less than 0.2 torr/ minute.
7.2.3.7 If all is well, press STOP several more times until the ANALGO OUTPUT screen is displayed.
7.2.3.8 Press STOP one more time . The system vents the chamber and goes to IDLE.
Gasonics Aura 1000 plasma Asher semiconductor equipment General Description for reference only
The Gasonics Aura 1000Plasma System is a microprocessor controlled down-stream, or “afterglow” photoresiststripper that will strip the front and backside of a wafer, typically in less than one minute.The Gasonics Aura 1000is fully automated, cassette-to-cassette, and is a single-wafer process design.
The Gasonics Aura 1000 system consists of two separate but interconnected.vacuum ·chambers (reaction and stripping),·a microwave plasma generator, automatic wafer loader/unloader, keypad panel/display, mass flowcontrollers (MFC’ s ), an infrared heat source, pneumatic and electronic control systems, ‘stainless steelgas plumbing, and incorporates several safety interlock features, as well as troubleshooting indicators .(LED’s) that illuminate to display the operating sequence and key component function signals.
The Gasonics Aura 1000 semiconductor process system is housed in one of three basic configurations:
1. A functional, convenient table-top cabinet;
2. Through-the-,wall; or
3. Stand-alone mounting table.
The Gasonics Aura 1000 Auia Stripper System generates a plasma of oxygen and/or other gasses in a reaction chamber.This concentrated reactive mixture then flows downstream, reaching a state of electrical neutrality,. and although highly reactive, it is no longer electrically damaging to the wafer. The mixture thenenters the process chamber, where the dissociated oxygen· reacts-with the photoresist and oxidizes or “burns” the photoresist from the wafer.
The main components of the Gasonics Aura 1000 Aura plasma reaction is atomic oxygen (normal oxygen consists of twoatoms, while atomic oxygen consists of only one atom). In addition, an infrared heat source is includedfor difficult or temperature sensitive processes.
A typical plasma wafer stripping process is as follows:
A. The wafer is loaded from a cassette into the process chamber, which is sealed andevacuated, and heat lamps are energized to elevate the wafer temperature.
B. Regulated process gasses are precisely released into the reaction chamber.
C. The microwave generator is enabled, creating the plasma in the reaction chamber andinitiating the downstream stripping action in the process chamber.
D. When end-point detection is reached and overstrip is achieved, the microwave generatorand process gasses are turned off to stop the stripping action, the process chamber ispurged with N2 to ambient temperature, and the stripped wafer is removed from thechamber and placed in another cassette.
Gasonics Aura 1000 System Features
Single wafer processing
One-to-four process gas MFC’s
3″, 4″, 5″, and 6″ wafer capability
Throughput: 60 wph, depending on process parameters.
3 Configurations: Table-top, Through-the-Wall,or with a stand-alone mounting table.
Programmable microprocessor
Automatic wafer loader/unloader
Infrared heat source for process temperature control.
Downstream processing: No wafer radiation damage.
Soft-start vacuum system.
Quartz or Ceramic plasma chamber.
Equipped with hard-wired safety interlocks to prevent damage to the system or injury to either the
product or to personnel.
Front and backside resist removal
Automatic photo emission type end-point detection
In-line cassette-to-cassette.
Compact: 36″ X 32″X27″ (Table Top).
